1. Precise Positioning: Model-specific heating modules provide accurate motherboard alignment for repair tasks.
2. Motherboard Layer Separation: Designed for compatible multilayer PCB separation and desoldering applications.
3. Interchangeable Design: Easily switch modules to accommodate different models and repair requirements.
4. Versatile Repair Applications: Compatible specialized modules support selected motherboard and CPU repairs.
5. Expandable Compatibility: Upgrade your existing MS1 platform with additional modules for supported models.
Note: This product is only compatible with the Mijing iRepair MS1.
Specification:
|
General
|
| Compatible with |
Apple:
iPhone 15 Pro
, iPhone 15
, iPhone 15 Plus
|
|
|
Package Weight
|
| One Package Weight |
0.07kgs / 0.16lb
|
| One Package Size |
10cm * 7cm * 2cm / 3.94inch * 2.76inch * 0.79inch
|
| Carton Weight |
17.80kgs / 39.24lb
|
| Carton Size |
42cm * 32cm * 30cm / 16.54inch * 12.6inch * 11.81inch
|
| Loading Container |
20GP: 661 cartons * 240 pcs = 158640 pcs
40HQ: 1535 cartons * 240 pcs = 368400 pcs
|
|
