1. Supports CPU and chip soldering, suitable for chips with hard drives, with a maximum soldering thickness of 0.9mm.
2. High flexibility, not easily deformed, good elasticity, and can be freely rolled up.
3. Heat-resistant and anti-slip, can withstand temperatures up to 500 degrees Celsius, with adhesive properties for effective anti-slip.
4. High-strength magnetic steel mesh with strong magnetic adsorption design ensures a stronger and more stable soldering.
5. Compatible with chips less than 0.9mm thick, for soldering most current smartphone chips.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
12cm * 7cm * 1cm / 4.72inch * 2.76inch * 0.39inch
|
| Carton Weight |
22.60kgs / 49.82lb
|
| Carton Size |
50cm * 44cm * 32cm / 19.69inch * 17.32inch * 12.6inch
|
| Loading Container |
20GP: 378 cartons * 720 pcs = 272160 pcs
40HQ: 879 cartons * 720 pcs = 632880 pcs
|
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