1. Specifically designed for vivo X80 Pro Dimensity Edition mid-layer, helping technicians accurately reball and repair the corresponding chip area.
2. Precisely arranged openings help control solder paste or solder ball placement, improving reballing accuracy and consistency.
3. The magnetic stencil helps maintain a stable position during operation, reducing unwanted movement and improving working efficiency.
4. Features a 0.12 mm thickness for controlled solder application and reliable alignment during motherboard repair.
5. The compact 70 x 70 mm format is convenient for handling, positioning, and storage on a professional repair workbench.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
10cm * 5cm * 1cm / 3.94inch * 1.97inch * 0.39inch
|
| Carton Weight |
19.00kgs / 41.89lb
|
| Carton Size |
42cm * 27cm * 32cm / 16.54inch * 10.63inch * 12.6inch
|
| Loading Container |
20GP: 734 cartons * 600 pcs = 440400 pcs
40HQ: 1705 cartons * 600 pcs = 1023000 pcs
|
|
