1. Specialized repair tool designed for mid-layer tin plating work on the S25 Ultra.
2. Facilitates precise solder plating and restoration during advanced smartphone motherboard repair.
3. Helps technicians perform controlled tin plating work on fine motherboard areas and connection points.
4. Suitable for professional technicians handling PCB repair, solder restoration and component-level maintenance.
5. A practical tool for mobile phone repair shops, motherboard technicians and electronics repair workstations.
6. Note: Only for Samsung Galaxy S25 Ultra.
Specification:
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Package Weight
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| One Package Weight |
0.05kgs / 0.12lb
|
| One Package Size |
10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch
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| Carton Weight |
9.00kgs / 19.84lb
|
| Carton Size |
42cm * 42cm * 52cm / 16.54inch * 16.54inch * 20.47inch
|
| Loading Container |
20GP: 290 cartons * 160 pcs = 46400 pcs
40HQ: 674 cartons * 160 pcs = 107840 pcs
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